as expected, the most load generates the most heat but it has less airflow, higher speed, less load, more airflow.
then the IC temp drops way off on decel since there's no load, so less heat being generated and lots of airflow.
so if you're on track you're probably in the worst area, high load, medium speed, medium airflow.
i'd like to see a graph that measured how long it takes for the IC to heatsoak, then how long it takes to cool off, if it can, so sustained high load, medium speed, til the temps max out.
next time i'm at the track i'll try to do something along those lines.
there is going to be a point where the efficiency maxes out and thats where we ought to be looking at, but a few degrees isn't going to do a whole lot, removing the rear panel dropped temps for us by about 20 degrees.