So when I start my car since there is no airflow to the IC it's heat soaked? Seriously, where do you get this nonsense?

San

Physics. -poke-

Given,

Zeroth law of thermo: if temp A = temp B and temp B = temp C, then temp A = temp C

where

temp A = Before IC

temp B = IC temp

temp C = After IC

things in a linked system will eventually reach thermal equilibrium, so [IC temp] reaches [before IC] -> [before IC] = [IC temp] -> [before IC] = [after IC].

Proof:

Specific Heat equation:

Q=cm*dT

where

Q = unit of heat(energy in transfer). [constant in our case]

c = object in particular's heat capacity(aluminum, air). [constant in our case]

m = mass. [constant in our case]

dt = final temp - initial temp. [variable]

in the case of 0 airflow at equilibrium, aka 0 cooling.

final temp IS initial temp,

then dt = final temp - initial temp = 0,

so Q = cm*0,

therefore Q = 0, aka no heat transfer, ergo heat soak.

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To take a step back to the original discussion:

Given Q = cm*dT and therefore Q/cm = dT, you may think doubling mass (2m) results in halved change in temp as in Q/(2cm) = dt/2

However, because all things reach equilibrium eventually, it just means it'll just take twice as long.

To put it simply:

If you place 1 pound of aluminum block and a 2 pound block on a heat plate(outputs energy at a constant rate), they'll both will reach the same temperature(equilibrium) as the heat plate. The difference is the 2 pound block will take twice as long. If you get a 100lbs block of aluminum on that heat plate, it'll also reach that thermal equilibrium. It'll just take that much longer.

In our case:

Say, if you hit 'heat soak' at lap 1 with 10lbs IC, you will have heat soaked at lap 2 with 20lbs IC.

To be fair, RLS IC could have better cooling efficiency due to larger surface area and/or bar&plate design when subjected through same amount of air.

IC is a device that depends on forced convection. The way to make it work better is by forcing more air through rather than adding mass. Besides, who'd want to add mass to the highest point away from the CoG?

On the other hand, A2W cooling would be more dependent on 'thermal mass', especially because water is has HUGE thermal capacity at ~4200J/kg*K. It takes a huge amount of energy to raise a kilo of water 1degreeC. It will stay at initial(ambient?) temperature for longer before it goes up in temp. Aluminum is comparatively tiny at ~900J/kg*K it'll go up in temp at the slightest chance.

Interesting thing is once the water in A2W heat soaks(eventually, preferably not before the race end), it'll just be as useless as heat soaked aluminum IC.

The point of my wall of text is not to bash RLS. I love their product. I'm just discussing science here.

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West oz loti, there's no 'camp'. It's true whether or not one believes in it.

Prove me otherwise, then I'll stand corrected.